An elastomeric tactile sensor employing dielectric constant variation and applicable to orthodontia

Fan Gang Tseng, Chih Sheng Yang, Li-Chern Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

This paper introduces a capacitive-type elastomeric tactile sensor for the application of orthodontia. Different from many capacitive-type tactile sensors employing gap-distance or electrode-overlap changing for pressure or shear signal measurement, this sensor applies electrostriction effect (dielectric constant change due to dielectric particles distance variation) for signal detection, thus allows electrodes placed on the same plane for orthodontia application. Biocompatible silicon rubber is used as the buffer layer to sustain large force. By particle distance variation increasing the equivalent particle concentration, this sensor can reach a sensitivity of 0.269nF/Mpa with a free load capacitance of 18pF, comparable to those from other type capacitive tactile sensors. Fabrication and simulation has been successfully carried out for comparison.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages564-567
Number of pages4
Publication statusPublished - 2004
Event17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS): Maastricht MEMS 2004 Technical Digest - Maastricht, Netherlands
Duration: Jan 25 2004Jan 29 2004

Other

Other17th IEEE International Conference on Micro Electro Mechanical Systems (MEMS): Maastricht MEMS 2004 Technical Digest
CountryNetherlands
CityMaastricht
Period1/25/041/29/04

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ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Tseng, F. G., Yang, C. S., & Pan, L-C. (2004). An elastomeric tactile sensor employing dielectric constant variation and applicable to orthodontia. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp. 564-567)