An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing

Jian Chiun Liou, Chun Jung Chen, Wen Chien Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A thermal bubble jet printhead design suitable for high speed and long life printing has been developed. It combines micromechanics including heating actuators, temperature sensor, channels and nozzles with a smart CMOS circuit including D Flip-Flops signal-processing along with bi-directional data transfer and 12V power amplifiers in a printhead chip. The asymmetric HV device structure (HV only apply on the Drain side, not source side) is recommended for lower Ron and higher current drive purpose. All of the jets of the printhead are controlled by very few input linesa pulse shape (ENABLE), a data line (DATA), a bit shift clock (BIT SHIFT), a state clearing pulse, 5-volt supply for the logic devices, a higher voltage for energizing the heater resisters, and a ground line. The study for application-specific integrated circuit (ASICs) within the inkjet system controller has been finished. Some inkjet process calculations are sufficiently time-urgent and/or extensive that it makes sense to design an ASIC to manage these tasks, we have fabricated a chip size 9000um×8000um printhead beyond 400 nozzles have a 5 pl. ink drop volume.

Original languageEnglish
Title of host publicationFinal Program and Proceedings of IS and T's NIP20
Subtitle of host publicationInternational Conference on Digital Printing Technologies
Pages898-902
Number of pages5
Publication statusPublished - 2004
Externally publishedYes
EventFinal Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies - Salt Lake City, UT, United States
Duration: Oct 31 2004Nov 5 2004

Conference

ConferenceFinal Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies
CountryUnited States
CitySalt Lake City, UT
Period10/31/0411/5/04

Fingerprint

Application specific integrated circuits
Nozzles
Logic devices
Micromechanics
Flip flop circuits
Temperature sensors
Data transfer
Power amplifiers
Ink
Printing
Clocks
Signal processing
Actuators
Heating
Controllers
Networks (circuits)
Electric potential
Integrated circuit design
Hot Temperature

ASJC Scopus subject areas

  • Media Technology

Cite this

Liou, J. C., Chen, C. J., & Liu, W. C. (2004). An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing. In Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies (pp. 898-902)

An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing. / Liou, Jian Chiun; Chen, Chun Jung; Liu, Wen Chien.

Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies. 2004. p. 898-902.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liou, JC, Chen, CJ & Liu, WC 2004, An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing. in Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies. pp. 898-902, Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies, Salt Lake City, UT, United States, 10/31/04.
Liou JC, Chen CJ, Liu WC. An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing. In Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies. 2004. p. 898-902
Liou, Jian Chiun ; Chen, Chun Jung ; Liu, Wen Chien. / An ASIC design for managing thermal inkjet heater array chip with integrated power drivers and logic addressing. Final Program and Proceedings of IS and T's NIP20: International Conference on Digital Printing Technologies. 2004. pp. 898-902
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