A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide Dynamic WIP dispatching in 300mm semiconductor manufacturing

Bo Li, Johnny Wu, Michael P. Herring, Chandra Mouli

Research output: Contribution to journalConference article

1 Citation (Scopus)

Abstract

With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (Work in Process) Dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper will describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel's manufacturing facilities, and employed in advanced 300mm factories to significantly reduce throughput times, inventory levels, and labor overhead.

Original languageEnglish
Article numberMC276
Pages (from-to)39-42
Number of pages4
JournalIEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
Publication statusPublished - Dec 15 2005
Externally publishedYes
EventIEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings - San Jose, CA, United States
Duration: Sep 13 2005Sep 15 2005

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide Dynamic WIP dispatching in 300mm semiconductor manufacturing'. Together they form a unique fingerprint.

  • Cite this